Hindley Circuits has extensive experience in accurately mounting surface mount components using the most advanced equipment. As such, we currently have three fully integrated state of the art surface mount lines coupled with inline automated inspection meaning that we can guarantee increased performance and precision.
Our capacities and capabilities include:
With the most sophisticated technology used for inspection – a 3D Automated Optical Inspection Platform – which displays any imperfections in a dynamic view allowing operators to inspect solder joints and verify correct part assembly we can validate that solder joint quality is at its highest whilst also eliminating the subjective nature of manual inspection.